Atomic layer deposition — Vocabulary (ISO 8181:2023)
< p class=" MsoBodyText" style=" mso-layout-grid-align: none text-autospace: none " > < span lang=" EN-GB" style=" mso-bidi-font-size: 12.0pt mso-fareast-font-family: SimSun mso-fareast-theme-font: minor-fareast " > This document defines general terms and film growth processes for atomic layer deposition (ALD). ALD technique is classified into conventional time separated ALD and spatial ALD according to the separation between sequential surface reactions of precursors on substrate. Besides planar substrate, ALD can be used for coating on micro-nano particles, which is developed as powder ALD. Some energy enhanced ALD techniques are also included. This document specifies the processes of different ALD methods.< / span>
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